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Inventor profile of:

Suk Jin Ham

City:

Suwon

Country:

South Korea

Published Applications:

Last publication date:

2014-07-03

Top Assignees for applications by Suk Jin Ham

The entities that hold a legal rights for patent applications filed by inventor Ham Suk Jin:

SAMSUNG ELECTRO-MECHANICS CO., LTD. 19 Suwon, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 3 Suwon-si, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 2 Gyunggi-do, South Korea
SUMSUNG ELECTRO-MECHANICS CO., LTD. 1 Suwon, South Korea
c/o SAMSUNG ELECTRO-MECHANICS CO., LTD. 1 Suwon, South Korea

Recent patent applications by Ham Suk Jin

Suk Jin Ham from Suwon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-07-03

US20140185244A1

Electricity

THERMALLY CONDUCTIVE FILM AND CIRCUIT BOARD MODULE

#2 | 2014-07-03

US20140184933A1

Physics

Touch panel and producing method for via electrode

#3 | 2014-06-26

US20140178814A1

Physics

DRY FILM PHOTORESIST HAVING OXYGEN PERMEABLE BARRIER LAYER AND MANUFACTURING METHOD THEREOF

#4 | 2014-06-26

US20140176828A1

Physics

TOUCH PANEL

#5 | 2014-06-26

US20140176506A1

Physics

Touch sensor

#6 | 2014-06-26

US20140176180A1

Physics

Apparatus for testing switching of power semiconductor module

#7 | 2014-06-26

US20140174193A1

Physics

METHOD, APPARATUS AND SAMPLE FOR EVALUATING BONDING STRENGTH

#8 | 2014-06-19

US20140170412A1

Chemistry; metallurgy

INSULATING COMPOSITION, SUBSTRATE INCLUDING INSULATING LAYER USING THE SAME, AND METHOD FOR MANUFACTURING THE SUBSTRATE

#9 | 2014-06-12

US20140158507A1

Electricity

TOUCH PANEL

#10 | 2014-06-05

US20140152980A1

Physics

INSPECTION DEVICE FOR SUBSTRATE DEFORMATION AT HIGH TEMPERATURES AND INSPECTION METHOD FOR SUBSTRATE DEFORMATION AT HIGH TEMPERATURES USING THE SAME

#11 | 2014-05-29

US20140147926A1

Physics

METHOD OF ANALYZING ALDEHYDE COMPOUND IN METAL PLATING SOLUTION

#12 | 2014-05-22

US20140140373A1

Physics

APPARATUS AND METHOD OF TESTING SEMICONDUCTOR MODULE

#13 | 2014-05-22

US20140138138A1

Electricity

PRINTED CIRCUIT BOARD HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN

#14 | 2014-05-15

US20140131083A1

Electricity

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

#15 | 2014-05-15

US20140131081A1

Electricity

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

#16 | 2014-05-15

US20140130347A1

Electricity

Method of manufacturing printed circuit board

#17 | 2014-04-24

US20140111790A1

Physics

PRETREATMENT METHOD AND APPARATUS

#18 | 2014-04-17

US20140106278A1

Physics

DRY FILM RESIST SHEET AND METHOD OF MANUFACTURING THE SAME

#19 | 2014-03-06

US20140061891A1

Electricity

SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

#20 | 2013-10-24

US20130281575A1

Chemistry; metallurgy

Insulating composition for substrate, and prepreg and substrate using the same

#21 | 2013-04-25

US20130099149A1

Electricity

Insulating layer composition for substrate, and prepreg and substrate using the same

#22 | 2013-02-28

US20130050901A1

Electricity

Multilayer ceramic electronic component and method of manufacturing the same

#23 | 2013-02-28

US20130048943A1

Electricity

ORGANIC LIGHT EMITTING DIODE AND FABRICATION METHOD THEREOF

InventorID:

108014 ⎘