Boise, Idaho
United States
34
2023-12-07
The entities that hold a legal rights for patent applications filed by inventor Vadhavkar Sameer S.:
Sameer S. Vadhavkar from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS
#2 | 2022-01-13Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
#3 | 2021-11-04Methods and systems for manufacturing pillar structures on semiconductor devices
#4 | 2021-06-03Pillar-last methods for forming semiconductor devices
#5 | 2020-11-05Apparatuses and methods for semiconductor die heat dissipation
#6 | 2020-07-02Methods and systems for manufacturing pillar structures on semiconductor devices
#7 | 2020-06-04Bonding pads with thermal pathways
#8 | 2020-03-26Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods
#9 | 2019-12-05Semiconductor devices with underfill control features, and associated systems and methods
#10 | 2019-11-14Semiconductor device assembly with heat transfer structure formed from semiconductor material
#11 | 2019-10-24Apparatuses and methods for semiconductor die heat dissipation
#12 | 2019-07-25Semiconductor device assembly with heat transfer structure formed from semiconductor material
#13 | 2019-07-04Pillar-last methods for forming semiconductor devices
#14 | 2019-06-06Apparatuses and methods for semiconductor die heat dissipation
#15 | 2018-12-27Bonding pads with thermal pathways
#16 | 2018-12-13Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods
#17 | 2018-12-13Bonding pads with thermal pathways
#18 | 2018-10-25METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS
#19 | 2018-05-03Semiconductor devices with underfill control features, and associated systems and methods
#20 | 2017-12-21Semiconductor device assembly with heat transfer structure formed from semiconductor material
#21 | 2017-08-10Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
#22 | 2017-08-03Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods
#23 | 2017-02-23Bonding pads with thermal pathways
#24 | 2016-12-22Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods
#25 | 2016-11-24Semiconductor device assembly with heat transfer structure formed from semiconductor material
#26 | 2016-08-25Apparatuses and methods for semiconductor die heat dissipation
#27 | 2016-08-11Bonding pads with thermal pathways
#28 | 2016-07-19Semiconductor device assembly with underfill containment cavity
#29 | 2016-01-14Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
#30 | 2016-01-14Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods
#31 | 2016-01-14Stacked semiconductor die assemblies with high efficiency thermal paths and associated systems
#32 | 2015-05-14Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods
#33 | 2013-05-16Magnetically adjusting color-converting materials within a matrix and associated devices, systems, and methods
#34 | 2013-02-28Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods
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