Inventor profile of:

Tom Herrmann

City:

Dresden

Country:

Germany

Published Applications:

23

Last publication date:

2025-09-04

Top Assignees for applications by Tom Herrmann

The entities that hold a legal rights for patent applications filed by inventor Herrmann Tom:

Recent patent applications by Herrmann Tom

Tom Herrmann from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-09-04
US20250279349A1
Electricity

CAPACITIVE JUNCTION BETWEEN CONDUCTIVE LINE AND CONDUCTIVE PILLAR WITH METHODS TO FORM SAME

#2 | 2025-04-24
US20250133735A1
Electricity

NONVOLATILE MEMORY WITH ISOLATION STRUCTURE AND METHOD OF FORMING THE SAME

#3 | 2024-05-23
US20240170576A1
Electricity

STRUCTURE WITH BACK-GATE HAVING OPPOSITELY DOPED SEMICONDUCTOR REGIONS

#4 | 2024-02-15
US20240055434A1
Electricity

STRUCTURE INCLUDING TRANSISTOR USING BURIED INSULATOR LAYER AS GATE DIELECTRIC AND TRENCH ISOLATIONS IN SOURCE AND DRAIN

#5 | 2023-06-22
US20230197731A1
Electricity

Structure including transistor using buried insulator layer as gate dielectric and trench isolations in source and drain

#6 | 2022-03-17
US20220085054A1
Electricity

Charge-trapping sidewall spacer-type non-volatile memory device and method

#7 | 2021-12-16
US20210391457A1
Electricity

Floating-gate devices in high voltage applications

#8 | 2020-05-05
US16258857
Electricity

Buried-channel low noise transistors and methods of making such devices

#9 | 2019-05-23
US20190157451A1
Electricity

Laterally double diffused metal oxide semiconductor (LDMOS) device on fully depleted silicon on insulator (FDSOI) enabling high input voltage

#10 | 2019-05-07
US15957072
Electricity

Thin body field effect transistor including a counter-doped channel area and a method of forming the same

#11 | 2019-04-11
US20190109192A1
Electricity

Transistor element with reduced lateral electrical field

#12 | 2019-02-14
US20190051747A1
Electricity

Fully depleted silicon on insulator (FDSOI) lateral double-diffused metal oxide semiconductor (LDMOS) for high frequency applications

#13 | 2018-11-06
US15620923
Electricity

Resistor structure with high resistance based on very thin semiconductor layer

#14 | 2018-03-29
US20180090558A1
Electricity

Capacitive structure in a semiconductor device having reduced capacitance variability

#15 | 2017-02-28
US14982028
Electricity

Method including a formation of a control gate of a nonvolatile memory cell and semiconductor structure

#16 | 2017-02-16
US20170047336A1
Electricity

Semiconductor structure including a nonvolatile memory cell and method for the formation thereof

#17 | 2014-07-24
US20140206157A1
Electricity

Method of forming a semiconductor structure including a vertical nanowire

#18 | 2014-01-30
US20140027825A1
Electricity

Threshold voltage adjustment in a fin transistor by corner implantation

#19 | 2013-10-24
US20130277746A1
Electricity

Integrated circuits having protruding source and drain regions and methods for forming integrated circuits

#20 | 2013-09-05
US20130230948A1
Electricity

MULTIPLE STEP IMPLANT PROCESS FOR FORMING SOURCE/DRAIN REGIONS ON SEMICONDUCTOR DEVICES

#21 | 2013-07-18
US20130181299A1
Electricity

Strain engineering in three-dimensional transistors based on strained isolation material

#22 | 2013-02-28
US20130049121A1
Electricity

Threshold voltage adjustment in a Fin transistor by corner implantation

#23 | 2012-10-18
US20120261725A1
Electricity

Stabilized metal silicides in silicon-germanium regions of transistor elements

InventorID:

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