Baltimore, Maryland
United States
15
2015-03-05
The entities that hold a legal rights for patent applications filed by inventor Van Heerden David:
David Van Heerden from Baltimore, US has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS
#2 | 2011-04-21Method for low temperature bonding of electronic components
#3 | 2011-03-24Reactive composite material structures with electrostatic discharge protection and applications thereof
#4 | 2011-02-03Methods of making reactive composite materials and resulting products
#5 | 2011-02-03GASKETLESS LOW TEMPERATURE HERMETIC SEALING WITH SOLDER
#6 | 2010-07-15Method For Bonding Of Concentrating Photovoltaic Receiver Module To Heat Sink Using Foil And Solder
#7 | 2009-07-16Method Of Making Reactive Composite Materials and Resulting Products
#8 | 2009-03-12Methods and device for controlling pressure in reactive multilayer joining and resulting product
#9 | 2009-02-05LOW TEMPERATURE REACTIVE COMPOSITE JOINING
#10 | 2008-04-24Multifunctional Reactive Composite Structures Fabricated From Reactive Composite Materials
#11 | 2006-01-31Reactive multilayer foil with conductive and nonconductive final products
#12 | 2006-01-31Methods of making and using freestanding reactive multilayer foils
#13 | 2005-06-09Methods and device for controlling pressure in reactive multilayer joining and resulting product
#14 | 2005-03-08Composite reactive multilayer foil
#15 | 2005-01-06Method of bonding and resulting product
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