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Inventor profile of:

Daisuke Ujihara

City:

Osaka

Country:

Japan

Published Applications:

1

Last publication date:

2013-02-28

Top Assignees for applications by Daisuke Ujihara

The entities that hold a legal rights for patent applications filed by inventor Ujihara Daisuke:

PANASONIC CORPORATION 1 Osaka, Japan

Recent patent applications by Ujihara Daisuke

Daisuke Ujihara from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-02-28

US20130049187A1

Resin-diamagnetic material composite structure

InventorID:

108402 ⎘