Tempe, Arizona
United States
17
2015-09-24
The entities that hold a legal rights for patent applications filed by inventor Mitchell Douglas G.:
Douglas G. Mitchell from Tempe, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers
#2 | 2015-04-30Microelectronic packages having layered interconnect structures and methods for the manufacture thereof
#3 | 2015-01-15Microelectronic packages and methods for the fabrication thereof
#4 | 2015-01-15Microelectronic packages having frontside thermal contacts and methods for the fabrication thereof
#5 | 2014-06-19SEMICONDUCTOR DEVICE PACKAGE HAVING BACKSIDE CONTACT AND METHOD FOR MANUFACTURING
#6 | 2014-03-13Microelectronic packages having trench vias and methods for the manufacture thereof
#7 | 2013-08-15Semiconductor device package having backside contact and method for manufacturing
#8 | 2013-06-20SEMICONDUCTOR DEVICE PACKAGING USING ENCAPSULATED CONDUCTIVE BALLS FOR PACKAGE-ON-PACKAGE BACK SIDE COUPLING
#9 | 2013-02-28Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits
#10 | 2012-01-26Method of forming a packaged semiconductor device
#11 | 2011-06-30Methods for forming through-substrate conductor filled vias, and electronic assemblies formed using such methods
#12 | 2010-11-04MEMS microphone with cavity and method therefor
#13 | 2010-05-27Through substrate vias for back-side interconnections on very thin semiconductor wafers
#14 | 2010-01-14Integrated conformal shielding method and process using redistributed chip packaging
#15 | 2009-11-05Method for controlling warpage in redistributed chip packaging panels
#16 | 2007-09-13Semiconductor device packaging
#17 | 2005-04-12Flip-chip structure and method for high quality inductors and transformers
108466 ⎘