Stuttgart
Germany
13
2023-05-18
The entities that hold a legal rights for patent applications filed by inventor DOESSEL Kerrin:
Kerrin DOESSEL from Stuttgart, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
MICROMECHANICAL DEVICE
#2 | 2022-02-10MEMS sensor including a diaphragm and method for manufacturing a MEMS sensor
#3 | 2021-12-09Readout signal generator and method for operating a capacitive device
#4 | 2021-11-18Micromechanical sensor unit and method for manufacturing a micromechanical sensor unit
#5 | 2021-09-02Micromechanical component and method for producing a micromechanical component
#6 | 2019-01-24Method and device for processing a signal
#7 | 2018-07-05Micromechanical sound transducer system and corresponding manufacturing method
#8 | 2018-03-01Micromechanical component and production method for a micromechanical component
#9 | 2017-12-07SENSOR AND/OR TRANSDUCER DEVICE AND METHOD FOR OPERATING A SENSOR AND/OR TRANSDUCER DEVICE HAVING AT LEAST ONE BENDING STRUCTURE, WHICH INCLUDES AT LEAST ONE PIEZOELECTRIC LAYER
#10 | 2017-11-16MICROMECHANICAL COMPONENT AND METHOD FOR PACKAGING A SUBSTRATE HAVING A MICRO-ELECTROMECHANICAL MICROPHONE STRUCTURE WHICH INCLUDES AT LEAST ONE PIEZOELECTRIC LAYER
#11 | 2017-02-23Assembly body for micromirror chips, mirror device and production method for a mirror device
#12 | 2017-02-23Mirror system and projection device
#13 | 2015-03-05Micromechanical component and method for producing a micromechanical component
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