Jericho, Vermont
United States
42
2020-03-12
The entities that hold a legal rights for patent applications filed by inventor Stone David B.:
David B. Stone from Jericho, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Shielded package assemblies with integrated capacitor
#2 | 2019-11-28FAN-OUT CONNECTIONS OF PROCESSORS ON A PANEL ASSEMBLY
#3 | 2019-09-19Interconnected integrated circuit (IC) chip structure and packaging and method of forming same
#4 | 2018-03-08Shielded package assemblies with integrated capacitor
#5 | 2017-05-25Reduced-warpage laminate structure
#6 | 2017-05-18Split ball grid array pad for multi-chip modules
#7 | 2017-05-04Shielded package assemblies with integrated capacitor
#8 | 2017-03-16Split ball grid array pad for multi-chip modules
#9 | 2016-06-02Reduced-warpage laminate structure
#10 | 2016-06-02Reduced-warpage laminate structure
#11 | 2015-12-03Shielded package assemblies with integrated capacitor
#12 | 2015-09-10Thermally enhanced three-dimensional integrated circuit package
#13 | 2015-09-10Chamfered corner crackstop for an integrated circuit chip
#14 | 2015-09-03Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures
#15 | 2015-08-27Integrated circuit structures having off-axis in-hole capacitor
#16 | 2015-08-27Shielded package assemblies with integrated capacitor
#17 | 2015-07-30Packages for three-dimensional die stacks
#18 | 2015-07-23Method, structures and method of designing reduced delamination integrated circuits
#19 | 2015-07-09Integrated circuit structures having off-axis in-hole capacitor and methods of forming
#20 | 2015-07-09Packages for three-dimensional die stacks
#21 | 2015-04-02Power distribution for 3D semiconductor package
#22 | 2015-02-12Semiconductor test and monitoring structure to detect boundaries of safe effective modulus
#23 | 2015-02-05Organic module EMI shielding structures and methods
#24 | 2014-08-14Elongated via structures
#25 | 2014-07-31Organic module EMI shielding structures and methods
#26 | 2014-01-30Elastic modulus mapping of a chip carrier in a flip chip package
#27 | 2014-01-23Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections
#28 | 2013-11-07Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits
#29 | 2013-10-31Elongated via structures
#30 | 2013-10-17Semiconductor test and monitoring structure to detect boundaries of safe effective modulus
#31 | 2013-04-25Chamfered corner crackstop for an integrated circuit chip
#32 | 2013-02-28Packaging identical chips in a stacked structure
#33 | 2012-07-26Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures
#34 | 2012-03-01Semiconductor test chip device to mimic field thermal mini-cycles to assess reliability
#35 | 2008-06-05VENTS WITH SIGNAL IMAGE FOR SIGNAL RETURN PATH
#36 | 2008-04-17Packaging reliability superchips
#37 | 2007-03-27Dual pitch contact pad footprint for flip-chip chips and modules
#38 | 2006-12-28Packaging reliability super chips
#39 | 2006-09-05Packaging reliability superchips
#40 | 2006-05-25Vents with signal image for signal return path
#41 | 2006-04-11Method of making an electronic package
#42 | 2005-12-20Vents with signal image for signal return path
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