Tokyo
Japan
28
2025-08-14
The entities that hold a legal rights for patent applications filed by inventor MAEDA Hiroshi:
Hiroshi MAEDA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
PROCESSING DEVICE AND PROCESSING METHOD
#2 | 2024-11-14VEHICLE
#3 | 2024-07-25Vehicle, control method for vehicle, and storage medium
#4 | 2022-10-06Driving support system for motorcycles
#5 | 2022-07-07Straddle type vehicle, method for controlling straddle type vehicle, and storage medium
#6 | 2022-06-30Estimation device and straddle-type vehicle
#7 | 2021-12-09Charging assistance system, method, and computer program
#8 | 2021-09-30SADDLE RIDE TYPE VEHICLE AND CONTROL APPARATUS
#9 | 2021-09-30Saddle ride type vehicle and control apparatus
#10 | 2021-09-16Straddle type vehicle and control apparatus
#11 | 2021-07-22Motorcycle
#12 | 2017-12-07Coil device and method for manufacturing the same
#13 | 2016-10-06Coil device and method for manufacturing the same
#14 | 2013-08-01Chondroitin sulfate having decreased molecular weight and use thereof
#15 | 2013-06-20Coil device
#16 | 2013-06-06Vertical transformer
#17 | 2013-05-30Transformer
#18 | 2013-02-28Coil device
#19 | 2012-11-15Coil component
#20 | 2011-08-04TRANSFORMER HAVING SECTIONED BOBBIN
#21 | 2010-11-11NOVEL CHONDROITIN SULFATE HAVING DECREASED MOLECULAR WEIGHT AND USE THEREOF
#22 | 2009-08-06AMELIORATING AGENT FOR BRAIN DAMAGE
#23 | 2008-07-03Information processing device, download method, download interruption method, download resuming method, and program
#24 | 2006-08-10Discharge lamp drive apparatus and liquid crystal display apparatus
#25 | 2006-05-25Discharge lamp drive apparatus and liquid crystal display apparatus
#26 | 2006-05-18Discharge lamp drive apparatus and liquid crystal display apparatus
#27 | 2006-05-04Discharge lamp drive device and liquid crystal display device
#28 | 2005-09-13Flip chip mounting method of forming a solder bump on a chip pad that is exposed through an opening formed in a polyimide film that includes utilizing underfill to bond the chip to a substrate
109670 ⎘