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Inventor profile of:

Daisuke Ohshima

City:

Tokyo

Country:

Japan

Published Applications:

11

Last publication date:

2014-12-04

Top Assignees for applications by Daisuke Ohshima

The entities that hold a legal rights for patent applications filed by inventor Ohshima Daisuke:

NEC Corporation 9 Tokyo, Japan
NEC CORPORATION 4 Minato-ku, Tokyo, Japan

Recent patent applications by Ohshima Daisuke

Daisuke Ohshima from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-12-04

US20140358827A1

Information processing device, information processing system, information processing method and computer-readable medium

#2 | 2014-01-23

US20140024177A1

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

#3 | 2013-05-23

US20130127037A1

SEMICONDUCTOR DEVICE BUILT-IN SUBSTRATE

#4 | 2013-04-11

US20130088841A1

SUBSTRATE WITH BUILT-IN FUNCTIONAL ELEMENT

#5 | 2013-02-28

US20130050967A1

FUNCTIONAL DEVICE-EMBEDDED SUBSTRATE

#6 | 2012-12-20

US20120319254A1

Wiring board with built-in semiconductor element

#7 | 2012-03-22

US20120068359A1

Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layer

#8 | 2011-07-21

US20110175213A1

Semiconductor device and manufacturing method thereof

#9 | 2011-06-30

US20110155433A1

Wiring board capable of containing functional element and method for manufacturing same

#10 | 2010-09-23

US20100237492A1

Semiconductor device and method for designing the same

#11 | 2007-02-08

US20070033564A1

Analysis method and analysis apparatus of designing transmission lines of an integrated circuit packaging board

InventorID:

111405 ⎘