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Inventor profile of:

Paul J. BROWN

City:

Wakefield

Country:

Canada

Published Applications:

Last publication date:

2019-03-21

Top Assignees for applications by Paul J. BROWN

The entities that hold a legal rights for patent applications filed by inventor BROWN Paul J.:

Alcatel-Lucent Canada, Inc. 3 Ottawa, Canada
Alcatel Lucent 3 BOULOGNE BILLANCOURT, France
Alcatel-Lucent USA Inc. 1 Murray Hill, NJ United States
ALCATEL LUCENT 1 Paris, France
Nokia Solutions and Networks Oy 1 Espoo, Finland
ALCATEL LUCENT 1 Boulogne-Biilancourt, France

Recent patent applications by BROWN Paul J.

Paul J. BROWN from Wakefield, CA has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2019-03-21

US20190087524A1

Physics

Spatial location of vias in a printed circuit board

#2 | 2018-06-14

US20180165401A1

Physics

NON-ORTHOGONAL ROUTING ON A PRINTED CIRCUIT BOARD

#3 | 2018-04-05

US20180098447A1

Electricity

Side clamping BGA socket

#4 | 2018-03-22

US20180082868A1

Electricity

GRAVITY FORCE COMPENSATION PLATE FOR UPSIDE DOWN BALL GRID ARRAY

#5 | 2017-11-28

US15140146

Electricity

Side clamping BGA socket

#6 | 2017-09-28

US20170280569A1

Electricity

EXTENDED PADS TO EASE REWORK FOR BTC AND BGA TYPE TECHNOLOGY

#7 | 2017-05-18

US20170142831A1

Electricity

Relieved component pad for 0201 use between vias

#8 | 2017-04-25

US15000941

Electricity

0204 shifted vias with merge pads

#9 | 2016-05-12

US20160135288A1

Electricity

Backdrill reliability anchors

#10 | 2015-04-02

US20150092373A1

Electricity

MOUNTING SOLUTION FOR COMPONENTS ON A VERY FINE PITCH ARRAY

#11 | 2011-09-29

US20110235304A1

Electricity

IC PACKAGE STIFFENER WITH BEAM

#12 | 2011-09-29

US20110235283A1

Electricity

Removable IC package stiffening brace and method

InventorID:

1117053 ⎘