Baoshan
Taiwan
7
2023-11-30
The entities that hold a legal rights for patent applications filed by inventor Luan Hongfa:
Hongfa Luan from Baoshan, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
Method of forming a semiconductor device by driving hydrogen into a dielectric layer from another dielectric layer
#2 | 2021-07-01Method of forming semiconductor device by driving hydrogen into a dielectric layer from another dielectric layer
#3 | 2020-10-08Semiconductor device having hydrogen in a dielectric layer
#4 | 2020-01-09Semiconductor device having hydrogen in a dielectric layer
#5 | 2019-04-04Method of forming a semiconductor device by high-pressure anneal and post-anneal treatment
#6 | 2015-08-06Semiconductor device manufacturing methods and methods of forming insulating material layers
#7 | 2015-04-16Semiconductor film with adhesion layer and method for forming the same
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