Osaka
Japan
7
2024-09-12
The entities that hold a legal rights for patent applications filed by inventor Kondo Daisuke:
Daisuke Kondo from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
COMPOSITE MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING COMPOSITE MATERIAL
#2 | 2023-11-02COMPOSITE MATERIAL, HEAT SPREADER AND SEMICONDUCTOR PACKAGE
#3 | 2022-03-10PALLET AND MANUFACTURING METHOD THEREOF
#4 | 2021-12-30Pallet
#5 | 2019-12-19DISPLAY SYSTEM, DISPLAY METHOD, AND REMOTE OPERATION SYSTEM
#6 | 2016-10-27Motion learning support apparatus
#7 | 2015-04-23Motion guide presentation method and system therefor, and motion guide presentation device
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