Inventor profile of:

MARK FREDERICK MCCOMBS

City:

CLAYTON, North Carolina

Country:

United States

Published Applications:

14

Last publication date:

2014-08-14

Top Assignees for applications by MARK FREDERICK MCCOMBS

The entities that hold a legal rights for patent applications filed by inventor MCCOMBS MARK FREDERICK:

Recent patent applications by MCCOMBS MARK FREDERICK

MARK FREDERICK MCCOMBS from CLAYTON, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-08-14
US20140224530A1
Electricity

Mixed-metal system conductors for use in low-temperature co-fired ceramic circuits and devices

#2 | 2013-02-28
US20130052433A1
Electricity

COMPOSITIONS FOR LOW K, LOW TEMPERATURE CO-FIRED COMPOSITE (LTCC) TAPES AND LOW SHRINKAGE, MULTI-LAYER LTCC STRUCTURES FORMED THEREFROM

#3 | 2012-08-09
US20120201009A1
Chemistry; metallurgy

LEAD FREE LTCC TAPE COMPOSITION

#4 | 2011-08-04
US20110187602A1
Chemistry; metallurgy

Method of manufacturing high frequency receiving and/or transmitting devices from low temperature co-fired ceramic materials and devices made therefrom

#5 | 2011-06-30
US20110155431A1
Electricity

Mixed-metal system conductors for LTCC (low-temperature co-fired ceramic)

#6 | 2009-04-30
US20090110939A1
Chemistry; metallurgy

LEAD FREE LTCC TAPE COMPOSITION

#7 | 2008-01-31
US20080023216A1
Chemistry; metallurgy

Method of forming low temperature cofired composite ceramic devices for high frequency applications and compositions used therein

#8 | 2007-10-11
US20070235694A1
Electricity

Thick film conductor compositions and the use thereof in LTCC circuits and devices

#9 | 2007-05-24
US20070113952A1
Electricity

Thick film conductor composition(s) and processing technology thereof for use in multilayer electronic circuits and devices

#10 | 2007-05-17
US20070111876A1
Chemistry; metallurgy

Lead free glass(es), thick film paste(s), tape composition(s) and low temperature cofired ceramic devices made therefrom

#11 | 2007-02-01
US20070023388A1
Electricity

Conductor composition for use in LTCC photosensitive tape on substrate applications

#12 | 2006-10-12
US20060228585A1
Electricity

Thick film paste via fill composition for use in LTCC applications

#13 | 2006-07-27
US20060163768A1
Chemistry; metallurgy

Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereof

#14 | 2006-07-27
US20060162844A1
Electricity

Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereof

InventorID:

114203 ⎘