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Inventor profile of:

Bin Cai

City:

Shenzhen

Country:

China

Published Applications:

Last publication date:

2023-12-28

Top Assignees for applications by Bin Cai

The entities that hold a legal rights for patent applications filed by inventor Cai Bin:

AAC TECHNOLOGIES PTE. LTD 13 Singapore, Singapore
AAC Technologies Pte. Ltd. 12 Singapore city, Singapore
AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. 2 Shenzhen, China
AAC MICROTECH (CHANGZHOU) CO., LTD. 1 Changzhou, China
HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED 1 Stamford, CT United States

Recent patent applications by Cai Bin

Bin Cai from Shenzhen, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-12-28

US20230421941A1

Electricity

WIRELESS EARBUD ASSEMBLY

#2 | 2019-12-12

US20190379957A1

Electricity

Speaker box

#3 | 2018-05-03

US20180124507A1

Electricity

Speaker

#4 | 2016-08-04

US20160227327A1

Electricity

Speaker Box

#5 | 2016-08-04

US20160227324A1

Electricity

Acoustic diaphragm and speaker box

#6 | 2016-08-04

US20160227322A1

Electricity

Speaker box

#7 | 2016-08-04

US20160227321A1

Electricity

Acoustic device

#8 | 2016-08-04

US20160227314A1

Electricity

Acoustic device

#9 | 2016-08-04

US20160227313A1

Electricity

Speaker box

#10 | 2016-08-04

US20160227304A1

Electricity

Speaker box

#11 | 2016-08-04

US20160225362A1

Physics

Acoustic device

#12 | 2016-01-21

US20160021447A1

Electricity

Speaker box

#13 | 2015-12-17

US20150365744A1

Electricity

Miniature speaker

#14 | 2015-11-05

US20150319535A1

Electricity

Miniature speaker

#15 | 2015-07-16

US20150201256A1

Electricity

Micro-speaker

#16 | 2015-06-25

US20150181345A1

Electricity

Miniature speaker

#17 | 2015-04-30

US20150117699A1

Electricity

Magnetic assembly for speaker

InventorID:

1143544 ⎘