Boise, Idaho
United States
12
2025-03-27
The entities that hold a legal rights for patent applications filed by inventor Kweon Young Do:
Young Do Kweon from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
#2 | 2022-11-24Semiconductor package using cavity substrate and manufacturing methods
#3 | 2022-04-21PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMENTS AND METHODS FOR MANUFACTURING THE SAME
#4 | 2020-09-24Semiconductor package using cavity substrate and manufacturing methods
#5 | 2019-10-17Semiconductor package using cavity substrate and manufacturing methods
#6 | 2018-12-13Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same
#7 | 2016-03-24Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same
#8 | 2015-04-30Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#9 | 2011-07-14Microelectronic devices
#10 | 2010-09-23Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#11 | 2008-02-28Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#12 | 2007-11-15Method of fabricating microelectronic devices
1144934 ⎘