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Inventor profile of:

Eung Suek Lee

City:

Suwon-Si

Country:

South Korea

Published Applications:

7

Last publication date:

2017-02-02

Top Assignees for applications by Eung Suek Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Eung Suek:

  • SAMSUNG ELECTRO-MECHANICS CO., LTD. 5 Suwon-si, South Korea
  • SAMSUNG ELECTRO-MECHANICS CO., LTD. 1 Suwon, South Korea

Recent patent applications by Lee Eung Suek

Eung Suek Lee from Suwon-Si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-02-02
US20170033039A1
Electricity

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

#2 | 2017-01-05
US20170004980A1
Electricity

Apparatus and method of manufacturing semiconductor package module

#3 | 2016-02-04
US20160037619A1
Electricity

CARRIER SUBSTRATE AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME

#4 | 2015-12-24
US20150373833A1
Electricity

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

#5 | 2015-07-09
US20150195902A1
Electricity

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

#6 | 2015-05-14
US20150129289A1
Electricity

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

#7 | 2011-03-31
US20110073252A1
Electricity

Conductive paste and method of manufacturing printed circuit board using the same

InventorID:

1156563 ⎘

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