HSINCHU COUNTY
Taiwan
18
2024-05-23
The entities that hold a legal rights for patent applications filed by inventor TU HSIEN-MING:
HSIEN-MING TU from HSINCHU COUNTY, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor package
#2 | 2024-02-15Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applications
#3 | 2021-12-16Method of manufacturing semiconductor package
#4 | 2021-07-22Conductive bump of a semiconductor device and fabricating method thereof
#5 | 2021-03-18Semiconductor device and manufacturing method thereof
#6 | 2020-08-27Semiconductor package and method of manufacturing semiconductor package
#7 | 2019-04-18Bump structure and fabricating method thereof
#8 | 2018-11-15Semiconductor device and manufacturing method thereof
#9 | 2018-02-01Method for manufacturing semiconductor structure
#10 | 2018-01-25Semicondcutor structure and semiconductor manufacturing process thereof
#11 | 2017-12-28Conductive terminal on integrated circuit
#12 | 2017-10-24Package structures having height-adjusted molding members and methods of forming the same
#13 | 2017-09-07Optical sensing system and associated electronic device
#14 | 2017-05-18Semiconductor structure and manufacturing method thereof
#15 | 2017-04-18Integrated circuit structure and seal ring structure
#16 | 2016-12-22Semiconductor device and manufacturing method thereof
#17 | 2015-08-20Semiconductor device and manufacturing method thereof
#18 | 2015-05-21Semiconductor device and fabricating method thereof
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