Michael Decker

City:

Regensburg

Country:

Germany

Published Applications:

Last publication date:

2017-06-29

Top Assignees for applications by Michael Decker

The entities that hold a legal rights for patent applications filed by inventor Decker Michael:

CONTINENTAL AUTOMOTIVE GMBH 5 Hannover, Germany
VDO AUTOMOTIVE AG 1 Regensburg, Germany
Continental Automotive AG 1 Munich, Germany
Continental Automotive GmbH 1 Munich, Germany
SIEMENS AKTIENGESELLSCHAFT SIEMENS AG 1 80506 MUNICH, Germany

Recent patent applications by Decker Michael

Michael Decker from Regensburg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-06-29

US20170187131A1

Electricity

Arrangement with circuit carrier for an electronic device

#2 | 2016-10-27

US20160313068A1

Mechanical engineering

Heat Pipe Having Displacement Bodies

#3 | 2016-01-21

US20160021730A1

Electricity

Electronic, optoelectronic, or electric arrangement

#4 | 2015-12-17

US20150366065A1

Electricity

DEVICE HAVING A CIRCUIT BOARD AND AN ELECTRONIC CIRCUIT WITH AN ELECTROLYTIC CAPACITOR ARRANGED ON THE CIRCUIT BOARD

#5 | 2015-05-21

US20150140844A1

Electricity

Releaseable electrical contact connection

#6 | 2010-08-05

US20100193223A1

Electricity

Solder resist coating for rigid-flex circuit boards and method of producing the solder resist coating

#7 | 2009-02-12

US20090040727A1

Electricity

Circuit Carrier Structure with Improved Heat Dissipation

#8 | 2008-08-28

US20080207020A1

Electricity

Combined fastening and contacting system for electrical components on superimposed circuit boards

#9 | 2008-01-31

US20080027155A1

Chemistry; metallurgy

Thermally Conductive Material for Electronic and/or Electrical Components, and Use Thereof

InventorID:

1168611 ⎘