BOON AIK EEO

City:

BAYAN LEPAS

Country:

Malaysia

Published Applications:

Last publication date:

2026-05-14

Top Assignees for applications by BOON AIK EEO

The entities that hold a legal rights for patent applications filed by inventor EEO BOON AIK:

BOON AIK EEO from BAYAN LEPAS, MY has applied for patents for these inventions. The list has both pending applications and granted patents:

CIRCUIT BOARD CONNECTOR

Device with a keypad that includes a bezel assembled with a flexible substrate

Portable communication device with camera mounting mechanism

APPARATUS AND METHOD FOR PROVIDING A SEAL AROUND A PERIMETER OF A BI-MATERIAL ENCLOSURE

InventorID:

1173441 ⎘