Beppu
Japan
23
2025-03-13
The entities that hold a legal rights for patent applications filed by inventor Aoya Kengo:
Kengo Aoya from Beppu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
FRAME DESIGN IN EMBEDDED DIE PACKAGE
#2 | 2024-06-27SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS
#3 | 2023-08-31Conductive members atop semiconductor packages
#4 | 2023-05-04Semiconductor package having an interdigitated mold arrangement
#5 | 2023-03-30Leaded wafer chip scale packages
#6 | 2023-03-02Power converter module
#7 | 2022-11-03Heat-dissipating wirebonded members on package surfaces
#8 | 2022-06-30Semiconductor device having tapered metal coated sidewalls
#9 | 2022-06-30Electronic package with surface contact wire extensions
#10 | 2022-04-07Embedded die packaging with integrated ceramic substrate
#11 | 2022-03-03TRANSFORMERS WITH SEPARATED MAGNETIC MEMBERS
#12 | 2021-06-10IC package with half-bridge power module
#13 | 2021-05-06Frame design in embedded die package
#14 | 2021-04-29METAL-COVERED CHIP SCALE PACKAGES
#15 | 2020-06-25Stress buffer layer in embedded package
#16 | 2020-03-19Embedded die packaging with integrated ceramic substrate
#17 | 2020-02-20Semiconductor package with multilayer mold
#18 | 2019-12-19Stress buffer layer in embedded package
#19 | 2016-08-18DUAL SIDED EMBEDDED DIE AND FABRICATION OF SAME BACKGROUND
#20 | 2015-05-28DUAL SIDED EMBEDDED DIE AND FABRICATION OF SAME BACKGROUND
#21 | 2011-08-04Protruding TSV tips for enhanced heat dissipation for IC devices
#22 | 2009-01-01Micro-ball loading device and loading method
#23 | 2008-08-21Transfer mask in micro ball mounter
1175781 ⎘