Danning Wang

City:

Beijing

Country:

China

Published Applications:

Last publication date:

2017-11-02

Top Assignees for applications by Danning Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Danning:

Danning Wang from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Multilayer wiring coupling dual interface card carrier-band module

Multilayer wiring type double-interface IC card antenna module

InventorID:

1189936 ⎘