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Inventor profile of:

Wei Du

City:

Shanghai

Country:

China

Published Applications:

Last publication date:

2024-02-15

Top Assignees for applications by Wei Du

The entities that hold a legal rights for patent applications filed by inventor Du Wei:

HUAWEI TECHNOLOGIES CO., LTD. 3 Shenzhen, China
DOW GLOBAL TECHNOLOGIES LLC 3 Midland, MI United States
The Dow Chemical Company 1 Midland, MI United States
Dow Chemical (China) Investment Company Limited 1 Shanghai, China
Huawei Device Co., Ltd. 1 Guangdong, China
Huawei Device Co., Ltd. 1 Dongguan, China
Baosteel Stainless Steel Co., Ltd. 1 Shanghai, China
Blue Cube IP LLC 1 St. Louis, MO United States

Recent patent applications by Du Wei

Wei Du from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-02-15

US20240054079A1

Physics

Application-level memory control group memory reclamation

#2 | 2023-06-08

US20230176980A1

Physics

Page swap method, storage system, and electronic device

#3 | 2021-09-30

US20210303181A1

Physics

Data processing method and apparatus

#4 | 2021-07-22

US20210224225A1

Physics

Data query method and apparatus

#5 | 2021-01-14

US20210012747A1

Physics

Frame rate adjustment method and terminal

#6 | 2019-10-03

US20190300981A1

Chemistry; metallurgy

Martensitic Stainless Steel and Manufacturing Process Therefor

#7 | 2017-09-07

US20170253690A1

Chemistry; metallurgy

Ester resins

#8 | 2016-09-08

US20160257811A1

Chemistry; metallurgy

A CURABLE EPOXY RESIN COMPOSITION

#9 | 2015-10-08

US20150284562A1

Chemistry; metallurgy

Curable epoxy composition and a composite made therefrom

#10 | 2015-07-30

US20150210846A1

Chemistry; metallurgy

CURABLE EPOXY RESIN COMPOSITIONS AND COMPOSITES MADE THEREFROM

#11 | 2015-06-11

US20150162110A1

Electricity

INSULATING COMPOSITES FOR POWER TRANSMISSION AND DISTRIBUTION

InventorID:

1190577 ⎘