Hangzhou
China
16
2021-12-09
The entities that hold a legal rights for patent applications filed by inventor Ye Jiaming:
Jiaming Ye from Hangzhou, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
DIE ATTACHMENT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#2 | 2021-11-04Package structure applied to power converter
#3 | 2021-09-23PACKAGE STRUCTURE FOR POWER CONVERTER AND MANUFACTURE METHOD THEREOF
#4 | 2020-06-11Chip package structure and method for forming chip package
#5 | 2018-12-20Package structure for power converter and manufacture method thereof
#6 | 2018-09-27Integrated package assembly for switching regulator
#7 | 2017-11-30Package structure of light emitter and light sensor with light-blocking layer and method for manufacturing the same
#8 | 2016-12-15Chip package method and package assembly
#9 | 2016-12-01Chip package structure and method for forming chip package
#10 | 2016-09-29Chip package assembly and manufacturing method thereof
#11 | 2016-07-28Package structure for power converter and manufacture method thereof
#12 | 2016-04-21Package assembly and method for manufacturing the same
#13 | 2015-09-03CHIP PACKAGE STRUCTURE
#14 | 2015-07-30Package assembly having interconnect for stacked electronic devices and method for manufacturing the same
#15 | 2015-07-30Integrated package assembly for switching regulator
#16 | 2015-06-11Multi-level leadframe with interconnect areas for soldering conductive bumps, multi-level package assembly and method for manufacturing the same
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