Keisuke Oguma

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2023-08-24

Top Assignees for applications by Keisuke Oguma

The entities that hold a legal rights for patent applications filed by inventor Oguma Keisuke:

Keisuke Oguma from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

NON-THERMOPLASTIC POLYIMIDE FILM, MULTI-LAYERED POLYIMIDE FILM AND METAL-CLAD LAMINATE

Low dielectric resin composition, molded article, film, multilayer film and flexible printed wiring board

HEAT DISSIPATION STRUCTURE

Heat dissipation structure

InventorID:

1192135 ⎘