Inventor profile of:

Jun Tan

City:

Shanghai

Country:

China

Published Applications:

20

Last publication date:

2026-01-01

Top Assignees for applications by Jun Tan

The entities that hold a legal rights for patent applications filed by inventor Tan Jun:

Recent patent applications by Tan Jun

Jun Tan from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-01-01
US20260005035A1
Electricity

METHOD FOR MANUFACTURING SEMICONDUCTOR EPITAXIAL LAYER

#2 | 2025-09-11
US20250282132A1
Performing operations; transporting

METHOD FOR PRODUCING A CURVED LAMINATED GLAZING

#3 | 2024-11-07
US20240370787A1
Physics

METHOD AND APPARATUS FOR CALCULATING CARBON INTENSITIES, TERMINAL AND STORAGE MEDIUM

#4 | 2024-08-22
US20240282646A1
Electricity

METHOD FOR MEASURING THICKNESS OF SILICON EPITAXIAL LAYER

#5 | 2024-05-23
US20240170344A1
Electricity

METHOD FOR MANUFACTURING SOURCE/DRAIN EPITAXIAL LAYER OF FDSOI MOSFET

#6 | 2024-05-23
US20240170287A1
Electricity

Epitaxial growth method for FDSOI hybrid region

#7 | 2023-10-19
US20230332328A1
Chemistry; metallurgy

Reaction Device for Improving Epitaxial Growth Uniformity

#8 | 2021-12-02
US20210376131A1
Electricity

Fin semiconductor device and method for making the same

#9 | 2021-12-02
US20210376128A1
Electricity

Fin semiconductor device and method for making the same

#10 | 2021-05-20
US20210146860A1
Performing operations; transporting

Exterior trimming part for pillar of vehicle

#11 | 2021-02-04
US20210036153A1
Electricity

Semiconductor device and method for manufacturing the same

#12 | 2018-12-20
US20180366584A1
Electricity

SiGe source/drain structure

#13 | 2018-08-23
US20180240718A1
Electricity

Embedded SiGe epitaxy test pad

#14 | 2018-06-07
US20180158951A1
Electricity

SiGe source/drain structure and preparation method thereof

#15 | 2017-08-31
US20170250186A1
Electricity

Method of fabricating semiconductor device and semiconductor device fabricated thereby

#16 | 2016-10-20
US20160308051A1
Electricity

SHAPED CAVITY FOR SIGE FILLING MATERIAL

#17 | 2016-10-20
US20160308050A1
Electricity

Shaped cavity for SiGe filling material

#18 | 2016-08-04
US20160225678A1
Electricity

Embedded SiGe epitaxy test pad

#19 | 2016-05-03
US14720829
Electricity

Methods and systems for using conformal filling layers to improve device surface uniformity

#20 | 2013-02-28
US20130055007A1
Physics

Estimating clock skew

InventorID:

119547 ⎘