Eric A. Pape

Determining and controlling substrate temperature during substrate processing

MATCHED TCR JOULE HEATER DESIGNS FOR ELECTROSTATIC CHUCKS

Ceramic baseplate with channels having non-square corners

Permanent secondary erosion containment for electrostatic chuck bonds

Reducing temperature transition in a substrate support

ESC CERAMIC SIDEWALL MODIFICATION FOR PARTICLE AND METALS PERFORMANCE ENHANCEMENTS

Method for reducing temperature transition in an electrostatic chuck

System and method for substrate support feed-forward temperature control based on RF power

Permanent secondary erosion containment for electrostatic chuck bonds

Connections between laminated heater and heater voltage inputs

Laminated heater with different heater trace materials

Method of determining thermal stability of a substrate support assembly

Multi-plane heater for semiconductor substrate support

Matched TCR joule heater designs for electrostatic chucks

System and method for reducing temperature transition in an electrostatic chuck

Auto-correction of electrostatic chuck temperature non-uniformity

Auto-correction of malfunctioning thermal control element in a temperature control plate of a semiconductor substrate support assembly that includes deactivating the malfunctioning thermal control element and modifying a power level of at least one functioning thermal control element

Calculating power input to an array of thermal control elements to achieve a two-dimensional temperature output

Method of determining thermal stability of a substrate support assembly