Byron, Minnesota
United States
15
2015-09-24
The entities that hold a legal rights for patent applications filed by inventor Colbert John L.:
John L. Colbert from Byron, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Packaging for eight-socket one-hop SMP topology
#2 | 2015-06-25Packaging for eight-socket one-hop SMP topology
#3 | 2014-09-18Implementing heat sink loading having multipoint loading with actuation outboard of heatsink footprint
#4 | 2014-05-08Implementing connection of two large electronic boards utilizing LGA interconnect
#5 | 2013-02-28Motherboard assembly for interconnecting and distributing signals and power
#6 | 2012-06-14Implementing loading and heat removal for hub module assembly
#7 | 2011-04-14Motherboard assembly for interconnecting and distributing signals and power
#8 | 2011-01-13Implementing enhanced connector guide block structures for robust SMT assembly
#9 | 2009-04-02Electronic assembly and techniques for installing a heatsink in an electronic assembly
#10 | 2009-02-05APPARATUS AND METHOD FOR ATTACHING HEATSINKS
#11 | 2008-12-18Cold plate stability
#12 | 2008-10-30Cold plate stability
#13 | 2008-07-10Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates
#14 | 2008-02-21Method and Apparatus for Applying Thermal Interface Material
#15 | 2008-01-31Heatsink apparatus for applying a specified compressive force to an integrated circuit device
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