Ballston Spa, New York
United States
7
2024-07-18
The entities that hold a legal rights for patent applications filed by inventor SMITH Daniel:
Daniel SMITH from Ballston Spa, US has applied for patents for these inventions. The list has both pending applications and granted patents:
STRUCTURE WITH AIR GAPS EXTENDING FROM DIELECTRIC LINER AROUND THROUGH SEMICONDCUTOR VIA
#2 | 2019-02-28Methods and structures for mitigating ESD during wafer bonding
#3 | 2018-06-07Integrated circuit product having a through-substrate-via (TSV) and a metallization layer that are formed after formation of a semiconductor device
#4 | 2018-04-19Deep trench metal-insulator-metal capacitors
#5 | 2018-02-08Methods of forming a through-substrate-via (TSV) and a metallization layer after formation of a semiconductor device
#6 | 2016-10-06INTEGRATION STRUCTURES FOR HIGH CURRENT APPLICATIONS
#7 | 2015-06-18Methods of protecting a dielectric mask layer and related semiconductor devices
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