Qi Wang

Superjunction structures for power devices

Power MOSFET Having a Strained Channel in a Semiconductor Heterostructure on Metal Substrate

Wafer level buck converter

Semiconductor device with (110)-oriented silicon

Three-dimensional semiconductor device structures and methods

Structure and method for forming planar gate field effect transistor with low resistance channel region

Method and structure for dividing a substrate into individual devices

Structure and method for forming field effect transistor with low resistance channel region

Semiconductor die packages using thin dies and metal substrates

BANDGAP ENGINEERED MOS-GATED POWER TRANSISTORS

Wafer level buck converter

Power MOSFET having a strained channel in a semiconductor heterostructure on metal substrate

(110)-oriented p-channel trench MOSFET having high-K gate dielectric

Structure and method for forming hybrid substrate

Technique for controlling trench profile in semiconductor structures

Three-dimensional semiconductor device structures and methods

Scalable power field effect transistor with improved heavy body structure and method of manufacture

Structure and method for forming field effect transistor with low resistance channel region

Method and structure for dividing a substrate into individual devices

Semiconductor device with (110)-oriented silicon

BONDING PAD STRUCTURE ALLOWING WIRE BONDING OVER AN ACTIVE AREA IN A SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING SAME

Power Semiconductor Devices with Barrier Layer to Reduce Substrate Up-Diffusion and Methods of Manufacture

Scalable power field effect transistor with improved heavy body structure and method of manufacture

Method for bonding a semiconductor substrate to a metal substrate

Semiconductor die packages using thin dies and metal substrates

Varying mesa dimensions in high cell density trench MOSFET

Power trench MOSFETs having SiGe/Si channel structure

Bandgap engineered MOS-gated power transistors

Power semiconductor devices and methods of manufacture