Joetsu
Japan
39
2020-09-03
The entities that hold a legal rights for patent applications filed by inventor DOMON Daisuke:
Daisuke DOMON from Joetsu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Multifunctional polymers
#2 | 2020-04-30Onium salt, negative resist composition, and resist pattern forming process
#3 | 2020-03-05Sulfonium compound, positive resist composition, and resist pattern forming process
#4 | 2019-11-28Onium salt, chemically amplified positive resist composition, and resist pattern forming process
#5 | 2019-11-28Monomer, polymer, negative resist composition, photomask blank, and resist pattern forming process
#6 | 2019-04-18Resist composition and patterning process
#7 | 2019-04-18Resist composition and patterning process
#8 | 2019-01-10Resist composition and resist patterning process
#9 | 2017-12-14Polymer, negative resist composition, and pattern forming process
#10 | 2017-11-30Polymer, positive resist composition, and pattern forming process
#11 | 2016-10-13Photomask blank, resist pattern forming process, and method for making photomask
#12 | 2016-10-13Negative resist composition and pattern forming process
#13 | 2016-10-13Chemically amplified negative resist composition using novel onium salt and resist pattern forming process
#14 | 2016-08-25Chemically amplified positive resist composition and pattern forming process
#15 | 2016-06-09Shrink material and pattern forming process
#16 | 2016-06-09Shrink material and pattern forming process
#17 | 2016-03-31Sulfonium salt, resist composition and resist pattern forming process
#18 | 2016-03-24Resist composition and patterning process
#19 | 2016-03-10Negative-tone resist compositions and multifunctional polymers therein
#20 | 2015-12-10Chemically amplified resist composition and pattern forming process
#21 | 2015-07-16Chemically amplified negative resist composition and patterning process
#22 | 2015-06-18Sulfonium salt, resist composition and resist pattern forming process
#23 | 2014-11-20Chemically amplified negative resist composition and patterning process
#24 | 2014-11-06Chemically amplified negative resist composition and patterning process
#25 | 2014-07-31Negative resist composition and patterning process
#26 | 2012-08-30Chemically amplified negative resist composition and patterning process
#27 | 2012-08-30Chemically amplified negative resist composition and patterning process
#28 | 2012-08-02Resist pattern forming process
#29 | 2012-02-02Polymerizable monomers
#30 | 2011-09-01Polymer, chemically amplified positive resist composition and pattern forming process
#31 | 2011-09-01Chemically amplified negative resist composition and patterning process
#32 | 2011-08-18Chemically amplified negative resist composition for EB or EUV lithography and patterning process
#33 | 2011-08-18Chemically amplified positive resist composition for EB or EUV lithography and patterning process
#34 | 2011-08-18Chemically amplified positive resist composition and pattern forming process
#35 | 2011-07-14Negative resist composition and patterning process
#36 | 2011-04-14Deprotection method of protected polymer
#37 | 2010-12-16Chemically amplified positive photoresist composition and pattern forming process
#38 | 2010-12-02Chemically amplified resist composition and pattern forming process
#39 | 2010-05-27Positive resist composition and patterning process
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