Ying Yang

City:

Suzhou

Country:

China

Published Applications:

Last publication date:

2025-11-13

Top Assignees for applications by Ying Yang

The entities that hold a legal rights for patent applications filed by inventor Yang Ying:

Ying Yang from Suzhou, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

3D INTEGRATED IMAGING DEVICES AND PREPARATION METHODS THEREOF

Chip packaging method and chip packaging structure

Chip to wafer package with top electrodes and method of forming

InventorID:

1228569 ⎘