Sung YI

City:

Suwon

Country:

Korea (South)

Published Applications:

Last publication date:

2014-10-23

Top Assignees for applications by Sung YI

The entities that hold a legal rights for patent applications filed by inventor YI Sung:

Sung YI from Suwon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

ELECTRONIC COMPONENT PACKAGE

Wafer Level Package For Heat Dissipation And Method Of Manufacturing The Same

InventorID:

12315 ⎘