• Recent
  • Class
  • Inventors
  • Assignees
  • Top Lists
  • Pricing
  • Account
Patents-Review.com
  1. Home
  2. Inventor
  3. C
  4. Cor…
  5. Cormier Mark
🔗 Permalink
Inventor profile of:

Mark Cormier

City:

Mesa, Arizona

Country:

United States

Published Applications:

6

Last publication date:

2015-07-30

Recent patent applications by Cormier Mark

Mark Cormier from Mesa, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-07-30
US20150210899A1
Chemistry; metallurgy

Adhesion Promoter with Nanoparticles, and Method of Manufacture thereof

#2 | 2015-07-30
US20150210898A1
Chemistry; metallurgy

Adhesion promoter and method of manufacture thereof

#3 | 2015-07-30
US20150210896A1
Chemistry; metallurgy

Screen and Method of Manufacture thereof

#4 | 2015-07-30
US20150210895A1
Chemistry; metallurgy

Screen using Nanoparticles, and Method of Manufacture thereof

#5 | 2015-07-30
US20150210861A1
Chemistry; metallurgy

Spall Shield and Method of Manufacture thereof

#6 | 2015-07-30
US20150210041A1
Performing operations; transporting

Spall Shield using Nanoparticles, and Method of Manufacture thereof

InventorID:

1238712 ⎘

  1. Home
  2. Inventor
  3. C
  4. Cor…
  5. Cormier Mark

Some parts © 2022-2026 Patents-Review.com

Browse & Discovery
  • Home
  • Patent Classification
  • Inventor Index
  • Assignee Index
  • Interesting Applications
Search & Tools
  • Basic Search
  • Advanced Search
  • Patent Alerts
  • Top Lists
  • Statistics
Information & Resources
  • About US Patent System
  • Terms & Privacy
  • Pricing
  • Contact
Quick Access
  • Latest Applications
  • Top Inventors 2026
  • Top Assignees 2026
  • Featured Patents
Disclaimer: This website is intended for informational purposes only, and its content is based on public patent records. Please note that some sections of this website have been created or processed using machine learning models. We provide content in good faith but make no guarantees regarding accuracy or completeness. By using this site, you accept any risks and waive claims against us for errors or omissions.