Vilnius
Lithuania
16
2025-03-06
The entities that hold a legal rights for patent applications filed by inventor NORKUS Eugenijus:
Eugenijus NORKUS from Vilnius, LT has applied for patents for these inventions. The list has both pending applications and granted patents:
PLATING SOLUTION FOR HIGH RATE ELECTROLESS DEPOSITION OF COPPER
#2 | 2024-12-05METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMICONDUCTORS
#3 | 2022-03-03Method for electroless nickel deposition onto copper without activation with palladium
#4 | 2019-11-28Method for formation of electro-conductive traces on polymeric article surface
#5 | 2015-10-29ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS
#6 | 2015-10-29ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS
#7 | 2015-10-29Electroless deposition of continuous cobalt layer using complexed Timetal ions as reducing agents
#8 | 2015-10-08Electroless deposition of continuous platinum layer using complexed Co metal ion reducing agent
#9 | 2015-08-20Electroless deposition of continuous platinum layer
#10 | 2012-06-21Electroless deposition from non-aqueous solutions
#11 | 2010-12-02Electroless deposition of cobalt alloys
#12 | 2010-03-23Plating solutions for electroless deposition of ruthenium
#13 | 2009-04-16Electroless deposition from non-aqueous solutions
#14 | 2008-06-26Electroless deposition of cobalt alloys
#15 | 2007-11-20Plating solutions for electroless deposition of copper
#16 | 2007-11-15Plating solution for electroless deposition of copper
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