Gilbert, Arizona
United States
15
2025-06-26
The entities that hold a legal rights for patent applications filed by inventor Li Lu:
Lu Li from Gilbert, US has applied for patents for these inventions. The list has both pending applications and granted patents:
MULTIPLE-STAGE MULTIPLE-PATH POWER AMPLIFIER WITH IN-PACKAGE AMPLIFIER DIES AND EXTERNAL INTER-STAGE POWER SPLITTER
#2 | 2024-06-27LOW-STRESS THERMAL INTERFACE
#3 | 2023-07-20METHOD OF FABRICATING SUBSTRATES WITH THERMAL VIAS AND SINTER-BONDED THERMAL DISSIPATION STRUCTURES
#4 | 2023-06-22Radio frequency packages containing multilevel power substrates and associated fabrication methods
#5 | 2023-06-15Radio frequency packages containing substrates with coefficient of thermal expansion matched mount pads and associated fabrication methods
#6 | 2023-05-04Surface-mount amplifier devices
#7 | 2022-12-01Thermal interface structures, electrical systems with thermal interface structures, and methods of manufacture thereof
#8 | 2022-03-03Substrate with thermal vias and sinter-bonded thermal dissipation structure
#9 | 2019-11-07Packaged microelectronic component mounting using sinter attachment
#10 | 2019-10-08Microelectronic modules including thermal extension levels and methods for the fabrication thereof
#11 | 2019-07-04Microelectronic components having integrated heat dissipation posts and systems including the same
#12 | 2019-04-23Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof
#13 | 2018-11-01Packaged microelectronic component mounting using sinter attachment
#14 | 2017-03-28Semiconductor package with isolation wall
#15 | 2015-08-20Semiconductor devices, semiconductor device packages, and packaging techniques for impedance matching and/or low frequency terminations
1265479 ⎘