John Knickerbocker

SEMICONDUCTOR STRUCTURES WITH INTEGRATED LASER DEBONDING TEST STRUCTURES

CO-PACKAGED OPTICAL MODULES

HIGH MIS-ALIGNMENT TOLERATE CO-PACKAGE OPTICS

MICRO-RING RESONATOR WITH DIRECT CONTACTS, HEATER AND UNDERCUT

MICRO-DISK RESONATOR WITH PRECISE DEPLETION LAYER

CO-PACKAGED OPTICS STRUCTURE WITH SUBSTRATE-EMBEDDED OPTICAL INTERCONNECTS

THERMAL SOLUTIONS FOR ARTIFICIAL INTELLIGENCE CHIPLET MODULES

SEMICONDUCTOR DEVICE WITH STACKED VIAS FOR HEAT REMOVAL

3D CHIPLET INTEGRATION TECHNOLOGY

ORTHOGONAL INDUCTORS

STRUCTURES WITH ENHANCED THERMAL HEAT SPREADING AND REMOVAL

HEAT SPREADING AND THERMAL HEAT REMOVAL STRUCTURES

S-PARAMETER DESIGN IN BACKSIDE POWER DISTRIBUTION NETWORK

TESTING DEVICE FOR TESTING SEMICONDUCTORS

TESTING DEVICE FOR TESTING SEMICONDUCTORS AND METHODS OF FABRICATION

SILICON PHOTONIC PLATFORM

HEAT SPREADER WITH REDISTRIBUTION LAYER

TESTING STRUCTURE FOR SEMICONDUCTOR DEVICES

ON-CHIP OPTICAL THROUGH-SILICON VIA

THERMAL MANAGEMENT STRUCTURE FOR MEMORY STACKS ON LOGIC

Thermal Resistance Extraction for Semiconductor Devices

HEAT SPREADER WITH PINS FOR THE THERMAL MANAGEMENT IMPROVEMENT OF CHIPLETS

CHIPLET INTEGRATION STRUCTURE FOR THERMAL MANAGEMENT

HIGH BANDWIDTH MEMORY CUBE

SEMICONDUCTOR PACKAGING STRUCTURE WITH GRAPHITE SHEETS

BIDIRECTIONAL WAFER-LEVEL LIGHT COUPLING

RELEASE LAYER CONTAINING SEMICONDUCTOR-ON-INSULATOR SUBSTRATES

ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY

HEAT SPREADER FOR MODIFIED EDGE COOLING

ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELECTRONIC DEVICES

INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

CO-PACKAGE OPTICS ASSEMBLY

WAFER DIES WITH THERMALLY CONDUCTING PERIMETER REGIONS

Infrared debond damage mitigation by copper fill pattern

STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING

ISOLATING HEAT SPREADER

Silicon handler with laser-release layers

Multiple die assembly

High density interconnection and wiring layers, package structures, and integration methods

Electronic substrate stacking

CARRIER WAFER WITH MULTIPLE ANTIREFLECTIVE COATING LAYERS

Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection

Health and fitness tracking

Wearable multiplatform sensor

Accurate colorimetric based test strip reader system

High speed handling of ultra-small chips by selective laser bonding and debonding

Accurate colorimetric based test strip reader system

High speed handling of ultra-small chips by selective laser bonding and debonding

WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING

SENSORS FACILITATING MONITORING OF LIVING ENTITIES

Thin film solid-state microbattery packaging

Thin film solid-state microbattery packaging

METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE WITH THE PROTRUSIONS ATTACHED

Wafer stacking for integrated circuit manufacturing

Test probe head for full wafer testing

Method of forming surface protrusions on an article and the article with the protrusions attached

Method of forming surface protrusions on an article and the article with the protrusions attached

Assembly Method For Reworkable Chip Stacking With Conductive Film

REWORKABLE CHIP STACK