Jun Utsumi

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2017-12-14

Top Assignees for applications by Jun Utsumi

The entities that hold a legal rights for patent applications filed by inventor Utsumi Jun:

Jun Utsumi from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Room-temperature-bonded semiconductor device and manufacturing method of room-temperature-bonded semiconductor device

Room temperature bonding apparatus and room temperature bonding method

ROOM-TEMPERATURE BONDING APPARATUS AND ROOM-TEMPERATURE BONDING METHOD

Remedies for psychoneurosis

InventorID:

1278553 ⎘