Beth M. Eichler-Johnson

City:

St. Paul, Minnesota

Country:

United States

Published Applications:

Last publication date:

2018-11-22

Top Assignees for applications by Beth M. Eichler-Johnson

The entities that hold a legal rights for patent applications filed by inventor Eichler-Johnson Beth M.:

H.B. Fuller Company 2 St. Paul, MN United States
H.B. Fuller Licensing & Financing, Inc. 1 St. Paul, MN United States

Recent patent applications by Eichler-Johnson Beth M.

Beth M. Eichler-Johnson from St. Paul, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-11-22

US20180334597A1

Chemistry; metallurgy

Hot melt adhesive composition

#2 | 2015-09-17

US20150259578A1

Chemistry; metallurgy

HOT MELT ADHESIVE COMPOSITIONS THAT INCLUDE PROPYLENE POLYMER AND ETHYLENE COPOLYMER

#3 | 2008-03-27

US20080076860A1

Chemistry; metallurgy

Hot melt pressure sensitive adhesive composition that includes vegetable wax and articles including the same

InventorID:

1289034 ⎘