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Inventor profile of:

Eisuke Shiga

City:

Tokyo

Country:

Japan

Published Applications:

18

Last publication date:

2022-03-10

Top Assignees for applications by Eisuke Shiga

The entities that hold a legal rights for patent applications filed by inventor Shiga Eisuke:

Recent patent applications by Shiga Eisuke

Eisuke Shiga from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-03-10
US20220076859A1
Electricity

Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board

 #2 | 2020-10-15
US20200325292A1
Chemistry; metallurgy

RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD

 #3 | 2020-05-14
US20200152349A1
Electricity

Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board

 #4 | 2018-07-12
US20180199435A1
Electricity

Resin composition, prepreg, metal foil-clad laminate, and printed circuit board

 #5 | 2018-07-12
US20180197655A1
Electricity

RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

 #6 | 2018-07-05
US20180186952A1
Chemistry; metallurgy

Resin composition and prepreg, resin sheet, laminate, and printed circuit board

 #7 | 2018-07-05
US20180186933A1
Chemistry; metallurgy

Resin composition, prepreg, metal foil-clad laminate, and printed circuit board

 #8 | 2018-06-28
US20180179355A1
Chemistry; metallurgy

Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board

 #9 | 2018-06-28
US20180179354A1
Chemistry; metallurgy

Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same

 #10 | 2018-06-28
US20180179353A1
Chemistry; metallurgy

Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them

 #11 | 2018-06-21
US20180177047A1
Electricity

Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them

 #12 | 2018-06-14
US20180163048A1
Chemistry; metallurgy

METHOD FOR PRODUCING PRINTED CIRCUIT BOARD, AND RESIN COMPOSITION

 #13 | 2018-06-07
US20180155514A1
Chemistry; metallurgy

Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board

 #14 | 2016-10-20
US20160309582A1
Electricity

Insulating layer for printed circuit board and printed circuit board

 #15 | 2016-07-28
US20160219700A1
Electricity

Prepreg, metal foil-clad laminate, and printed wiring board

 #16 | 2015-11-05
US20150319853A1
Electricity

Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board

 #17 | 2015-10-29
US20150307708A1
Chemistry; metallurgy

Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board

 #18 | 2015-09-24
US20150267047A1
Chemistry; metallurgy

Resin composition, prepreg, laminate, and printed wiring board
InventorID:

1296359 ⎘