Austin, Texas
United States
7
2023-03-23
The entities that hold a legal rights for patent applications filed by inventor Atherton Steven A.:
Steven A. Atherton from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Chip scale package
#2 | 2022-09-08Via structure for semiconductor dies
#3 | 2022-08-04Chip scale package
#4 | 2020-10-29Via structure for semiconductor dies
#5 | 2017-06-22Semiconductor device package substrate having a fiducial mark
#6 | 2017-04-18Semiconductor device package substrate having a fiducial mark
#7 | 2015-10-01Integrated circuit interconnect crack monitor circuit
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