Rochester, Minnesota
United States
31
2015-01-08
The entities that hold a legal rights for patent applications filed by inventor Sinha Arvind Kumar:
Arvind Kumar Sinha from Rochester, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Method of manufacturing a venting device for tamper resistant electronic modules
#2 | 2014-08-28Method and system for allignment of graphite nanofibers for enhanced thermal interface material performance
#3 | 2013-03-07Product tracking system
#4 | 2012-11-29Use of a local constraint to enhance attachment of an IC device to a mounting platform
#5 | 2012-01-26Method and system for alignment of graphite nanofibers for enhanced thermal interface material performance
#6 | 2011-12-22Flux-free detachable thermal interface between an integrated circuit device and a heat sink
#7 | 2011-10-06Piezoelectric chromic impact sensor
#8 | 2011-07-28Implementing reduced signal degradation for fiber optic modules
#9 | 2009-04-30Apparatus and method providing metallic thermal interface between metal capped module and heat sink
#10 | 2008-10-30Mounting a heat sink in thermal contact with an electronic component
#11 | 2008-10-23Mounting a heat sink in thermal contact with an electronic component
#12 | 2008-10-21Three-dimensional stackable die configuration for an electronic circuit board
#13 | 2008-10-21Stacked multiple electronic component interconnect structure
#14 | 2008-07-31Socket and method for compensating for differing coefficients of thermal expansion
#15 | 2008-04-17Socket and method for compensating for differing coefficients of thermal expansion
#16 | 2008-04-17Method for manufacturing a socket that compensates for differing coefficients of thermal expansion
#17 | 2008-01-03Method for producing an organic substrate with integral thermal dissipation channels
#18 | 2007-12-04Socket and method for compensating for differing coefficients of thermal expansion
#19 | 2007-11-20Organic substrate with integral thermal dissipation channels, and method for producing same
#20 | 2007-10-18Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
#21 | 2007-07-05Method of manufacturing a venting device for tamper resistant electronic modules
#22 | 2007-04-19Method and apparatus for optimizing heat transfer with electronic components
#23 | 2007-02-15Mounting a heat sink in thermal contact with an electronic component
#24 | 2006-08-03System and method for optimizing heat management
#25 | 2006-06-15Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
#26 | 2006-06-15Solder reflow system and method thereof
#27 | 2006-05-04Venting device for tamper resistant electronic modules
#28 | 2005-12-15Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit
#29 | 2005-09-22Tamper-proof enclosure for a circuit card
#30 | 2005-06-09Dissipating heat reliably in computer systems
#31 | 2005-01-13Method and apparatus for mounting a heat transfer apparatus upon an electronic component
131112 ⎘