Mark EBLEN

City:

Temecula, California

Country:

United States

Published Applications:

Last publication date:

2019-01-03

Top Assignees for applications by Mark EBLEN

The entities that hold a legal rights for patent applications filed by inventor EBLEN Mark:

Mark EBLEN from Temecula, US has applied for patents for these inventions. The list has both pending applications and granted patents:

MICROELECTRONIC PACKAGE CONSTRUCTION ENABLED THROUGH CERAMIC INSULATOR STRENGTHENING AND DESIGN

Lead package and method for minimizing deflection in microelectronic packaging

Heat management in electronics packaging

InventorID:

1317010 ⎘