Berlin
Germany
3
2024-10-10
The entities that hold a legal rights for patent applications filed by inventor Klobus Marcin:
Marcin Klobus from Berlin, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARD INCLUDING MICROVIAS FILLED WITH COPPER
#2 | 2022-09-01Method of preparing a high density interconnect printed circuit board including microvias filled with copper
#3 | 2015-10-08METHOD FOR COMBINED THROUGH-HOLE PLATING AND VIA FILLING
1318357 ⎘