🔗 Permalink

Inventor profile of:

Ted Chen

City:

Shanghai

Country:

China

Published Applications:

1

Last publication date:

2015-10-08

Recent patent applications by Chen Ted

Ted Chen from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-10-08

US20150289387A1

METHOD FOR COMBINED THROUGH-HOLE PLATING AND VIA FILLING

InventorID:

1318359 ⎘