Peter J. Nystrom

System and method for operating a multi-nozzle extruder during additive manufacturing

SYSTEM AND METHOD FOR OPERATING A MULTI-NOZZLE EXTRUDER DURING ADDITIVE MANUFACTURING

System and method for preserving valve member travel in a multi-nozzle extruder

Patterned pre-stop for finishing additive manufactured 3D objects

Filament heaters configured to facilitate thermal treatment of filaments for extruder heads in three-dimensional object printers

Method for operating an extruder in a three-dimensional (3D) object printer to improve layer formation

Imaging blanket and variable data lithography system employing the imaging blanket

IN-SITU TRANSPORT CLEANING

Method for operating a constant pressure filament driver to an extruder head in a three-dimensional object printer

Single extruder configuration that enables multi-color extrusions in three-dimensional object printers

System and method for providing three-dimensional object structural support with a multi-nozzle extruder

Optimized nozzle arrangement for an extruder head used in an additive manufacturing system

Method for operating an extruder assembly in a three-dimensional object printer

Method for alignment of a multi-nozzle extruder in three-dimensional object printers

System and method for preserving valve member travel in a multi-nozzle extruder

System for operating extruder heads in three-dimensional object printers

Method for operating a multi-nozzle extruder using zig-zag patterns that provide improved structural integrity

ADDITIVE MANUFACTURING SYSTEM WITH HEATER CONFIGURED FOR IMPROVED INTERLAYER ADHESION IN A PART FORMED BY THE SYSTEM

Multi-nozzle extruder for use in three-dimensional object printers

Lead-free piezo printhead using thinned bulk material

System and method for roll alignment of a multi-nozzle extruder in three-dimensional object printers using cross-process measurements

System and method for alignment of a multi-nozzle extruder in three-dimensional object printers

Lead-free piezo printhead using thinned bulk material

System and method for cooling digital mirror devices

Single extruder configuration that enables multi-color extrusions in three-dimensional object printers

Method of operating extruder heads in three-dimensional object printers

Filament heaters configured to facilitate thermal treatment of filaments for extruder heads in three-dimensional object printers

Constant pressure filament driver for extruder heads in three-dimensional object printers

Raised fluid pass-through structure in print heads

Interlayer adhesion in a part printed by additive manufacturing

Extruder assembly for a three-dimensional object printer

System and method for forming integrated interfaces within a three-dimensionally printed object with different build materials

Method of forming piezo driver electrodes

Integrated piezo printhead

Extrusion printheads for three-dimensional object printers

Material feeder for engineering polymer ejection system for additive manufacturing applications

System and method for operation of multi-nozzle extrusion printheads in three-dimensional object printers

Three-dimensional object printer with multi-nozzle extruders and dispensers for multi-nozzle extruders and printheads

Integrated thin film piezoelectric printhead

Pin-actuated printhead

Raised fluid pass-through structure in print heads

Membrane bond alignment for electrostatic ink jet printhead

Printhead configured for use with high viscosity materials

Method of manufacturing ink jet printheads including electrostatic actuators

Printhead configured to refill nozzle areas with high viscosity materials

Flex circuit board with topographical structures to facilitate fluid flow through the layer

Electrostatic actuator with short circuit protection and process

Multiple thin film piezoelectric elements driving single jet ejection system

Hyperspectral single pixel imager with fabry perot filter

Printhead with nanotips for nanoscale printing and manufacturing

Electrostatic device improved membrane bonding

Electrostatic membrane diffusion bonding structure and process

MEMS actuator pressure compensation structure for decreasing humidity

Multi-layer electroformed nozzle plate with attenuation pockets

Double sided flex for improved bump interconnect

Thermo-pneumatic actuator working fluid layer

Thermo-pneumatic actuator fabricated using silicon-on-insulator (SOI)

Printhead with nanotips for nanoscale printing and manufacturing

Structure and method to fabricate tooling for bumping thin flex circuits

Method and structure for sealing fine fluid features in a printing device

Method for protecting piezoelectric transducer

Reduced mechanical coupling with structured flex circuits

High density three-dimensional electrical interconnections

Interstitial material to enable robust electrical interconnect for high density piezoelectric arrays

Diaphragm for an electrostatic actuator in an ink jet printer

Multiple layer filter

Laser welded bonding pads for piezoelectric print heads

Screen printed jet stack heater

Method for flex circuit bonding without solder mask for high density electrical interconnect

Patterned heater traces for inkjet printhead

Highly integrated wafer bonded MEMS devices with release-free membrane manufacture for high density print heads

Using saturated mesh to control adhesive bond line quality

Printhead fluid paths formed with sacrificial material patterned using additive manufacturing processes

Ultrasonic laminating of materials for ink jet printheads

Laser transmission laminating of materials for ink jet printheads

Ink jet printing systems and methods with pre-fill and dimple design

Polymer film as an interstitial fill for PZT printhead fabrication

Multi-film adhesive design for interfacial bonding printhead structures

Bonded silicon structure for high density print head

Process for adding thermoset layer to piezoelectric printhead

High density electrical interconnect using limited density flex circuits

In situ flexible circuit embossing to form an electrical interconnect

Method for interstitial polymer planarization using a flexible flat plate

High density electrical interconnect for printing devices using flex circuits and dielectric underfill

Patterned conductive array and self leveling epoxy

Use of photoresist material as an interstitial fill for PZT printhead fabrication

High density multilayer interconnect for print head

Method for modular arrangement of a silicon based array and modular silicon based array

Molded nozzle plate with alignment features for simplified assembly

Silicon interposer for MEMS scalable printing modules

Independent adjustment of drop mass and velocity using stepped nozzles

Method for modular arrangement of a silicon based array and modular silicon based array

Ink jet printing systems and methods with pre-fill and dimple design

Independent adjustment of drop mass and drop speed using nozzle diameter and taper angle

Printhead de-prime system and method for solid ink systems

Cast-in place ink feed structure using encapsulant

Buried traces for sealed electrostatic membrane actuators or sensors

Maintainable coplanar front face for silicon die array printhead

CIRCUITRY FOR PRINTER

Self-aligned precision datums for array die placement