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Inventor profile of:

Lenore Dai

City:

Phoenix, Arizona

Country:

United States

Published Applications:

8

Last publication date:

2025-01-23

Top Assignees for applications by Lenore Dai

The entities that hold a legal rights for patent applications filed by inventor Dai Lenore:

  • ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY 7 Scottsdale, AZ United States

Recent patent applications by Dai Lenore

Lenore Dai from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-01-23
US20250026896A1
Chemistry; metallurgy

Stress-Responsive Composites

#2 | 2024-01-18
US20240018296A1
Chemistry; metallurgy

Mechanophore-grafted polymers to form stress-responsive thermoset network

#3 | 2022-08-04
US20220243017A1
Chemistry; metallurgy

Stress-responsive composites

#4 | 2021-09-09
US20210277172A1
Chemistry; metallurgy

Mechanophore-grafted polymers to form stress-responsive thermoset network

#5 | 2020-07-16
US20200223993A1
Chemistry; metallurgy

Stress-responsive composites

#6 | 2020-06-18
US20200190250A1
Chemistry; metallurgy

Mechanophore-grafted polymers to form stress-responsive thermoset network

#7 | 2019-06-20
US20190187047A1
Physics

In-situ damage detection system for mechanophore-embedded fiber reinforced composites

#8 | 2015-10-22
US20150302772A1
Physics

Responsive dynamic three-dimensional tactile display using hydrogel

InventorID:

1333411 ⎘

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