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Inventor profile of:

Kohei DOI

City:

Osaka

Country:

Japan

Published Applications:

5

Last publication date:

2015-03-05

Top Assignees for applications by Kohei DOI

The entities that hold a legal rights for patent applications filed by inventor DOI Kohei:

  • NITTO DENKO CORPORATION 3 Osaka, Japan
  • NITTO DENKO CORPORATION 1 Ibaraki-shi, Osaka, Japan
  • NITTO DENKO CORPORATION 1 Ibaraki-shi, Japan

Recent patent applications by DOI Kohei

Kohei DOI from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-03-05
US20150062896A1
Chemistry; metallurgy

Flame-retardant silicone resin composition and flame-retardant silicone resin sheet

#2 | 2013-03-14
US20130065016A1
Electricity

THERMAL CONDUCTIVE SHEET AND PRODUCING METHOD THEREOF

#3 | 2013-03-14
US20130062046A1
Chemistry; metallurgy

THERMAL CONDUCTIVE SHEET AND PRODUCING METHOD THEREOF

#4 | 2010-12-02
US20100304104A1
Performing operations; transporting

Viscoelastic articles with polymer layer containing elastomer unevenly distributed

#5 | 2010-12-02
US20100304103A1
Performing operations; transporting

GAS BARRIER ARTICLES WITH POLYMER LAYER CONTAINING GAS BARRIER MATERIAL UNEVENLY DISTRIBUTED AND PROCESS FOR PRODUCING THE SAME

InventorID:

133467 ⎘

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