Inventor profile of:

Nancy C. LaBianca

City:

Yalesville, Connecticut

Country:

United States

Published Applications:

14

Last publication date:

2013-03-14

Top Assignees for applications by Nancy C. LaBianca

The entities that hold a legal rights for patent applications filed by inventor LaBianca Nancy C.:

Recent patent applications by LaBianca Nancy C.

Nancy C. LaBianca from Yalesville, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-03-14
US20130062740A1
Electricity

Tunable radiation source

#2 | 2012-02-23
US20120045853A1
Electricity

SER testing for an IC chip using hot underfill

#3 | 2011-02-10
US20110034047A1
Performing operations; transporting

Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging

#4 | 2010-01-07
US20100003786A1
Electricity

Chip-level underfill method of manufacture

#5 | 2009-10-22
US20090263991A1
Performing operations; transporting

Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging

#6 | 2009-10-08
US20090251698A1
Electricity

Method and system for collecting alignment data from coated chips or wafers

#7 | 2009-09-24
US20090236699A1
Electricity

Discrete placement of radiation sources on integrated circuit devices

#8 | 2008-08-26
US10310532
-

Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging

#9 | 2008-02-28
US20080048305A1
Performing operations; transporting

Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging

#10 | 2006-10-05
US20060220654A1
Physics

Packaging integrated circuits for accelerated detection of transient particle induced soft error rates

#11 | 2006-07-20
US20060157223A1
Electricity

Heterogeneous thermal interface for cooling

#12 | 2006-06-22
US20060131738A1
Electricity

Method and apparatus for chip cooling using a liquid metal thermal interface

#13 | 2005-08-02
US9782494
-

Bilayer wafer-level underfill

#14 | 2005-03-24
US20050061474A1
Electricity

Method and apparatus for chip-cooling

InventorID:

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