Armonk, New York
United States
3
2015-05-28
The entities that hold a legal rights for patent applications filed by inventor Feger Claudius:
Claudius Feger from Armonk, US has applied for patents for these inventions. The list has both pending applications and granted patents:
No flow underfill or wafer level underfill and solder columns
#2 | 2015-05-28No flow underfill or wafer level underfill and solder columns
#3 | 2013-03-14No flow underfill or wafer level underfill and solder columns
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